• DocumentCode
    407300
  • Title

    Tunable oxide-bypassed superjunction structure: breaking the silicon performance limit

  • Author

    Yang, Xin ; Liang, Yung C. ; Samudra, Ganesh S. ; Liu, Yong

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
  • Volume
    1
  • fYear
    2003
  • fDate
    17-20 Nov. 2003
  • Firstpage
    66
  • Abstract
    We have recently reported an oxide-bypassed (OB) superjunction structure that utilizes the well-established oxide thickness control in fabrication instead of the difficult doping control in translating the unipolar on-resistance Ron versus the blocking voltage VBR tradeoff limit beyond the conventional unipolar silicon limit [Y.C. Liang et al., August 2001]. Further enhancement on the breakdown voltage to compensate process variation can be achieved by applying an external bias to the poly contact of the OB trench. This bias provides an independent control in adjusting maximum breakdown voltage. This paper describes the fabrication process and the laboratory results on the tunable oxide-bypassed superjunction structure.
  • Keywords
    power MOSFET; semiconductor doping; silicon; blocking voltage; doping control; fabrication process; maximum breakdown voltage; metal-oxide-semiconductor field effect transistor; oxide thickness control; power MOSFET; silicon performance limit; superjunction devices; tunable oxide-bypassed superjunction structure; unipolar silicon limit; Doping profiles; Electric breakdown; Electrodes; Fabrication; Medical simulation; Microelectronics; PIN photodiodes; Silicon; Thickness control; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Drive Systems, 2003. PEDS 2003. The Fifth International Conference on
  • Print_ISBN
    0-7803-7885-7
  • Type

    conf

  • DOI
    10.1109/PEDS.2003.1282680
  • Filename
    1282680