Design tools for packaging

Increasing package design complexity and performance requirements, shorter time to market demands, and cost reduction targets require efficient tool suites and standardized design processes. There is a need to integrate design tools, environments and processes to provide a true concurrent design methodology between IC, Package and Board. This paper focuses specifically on the necessary evil "Packaging" area. It describes how Intel\´s packaging tools evolved through the years and outlines the future challenges that need to be addressed to make the overall process as seamless as possible.