• DocumentCode
    408391
  • Title

    Fracture behaviour of single crystal silicon microstructures

  • Author

    Meroni, F. Favalli ; Mazza, E.

  • Author_Institution
    Inst. of Mech. Syst., Eidgenossische Tech. Hochschule, Zurich, Switzerland
  • fYear
    2003
  • fDate
    5-7 May 2003
  • Firstpage
    329
  • Lastpage
    334
  • Abstract
    The fracture behaviour of single crystal silicon (SCSi) microstructures is analysed based on micromechanical torsional and tensile experiments. The uniaxial testpieces are characterised by the presence of sharp notches at the gauge length extremities. The critical loading conditions are reproduced in a finite element model in order to identify the analogies of the failure conditions in tension and torsion. The stress field in the vicinity of the notch tip (were cracks originate) is analyzed, and fracture mechanics parameters are determined. In the finite element model a crack, reproducing the failure process observed in the experiments, is included. The crack area is incrementally increased and the energy release rate for the critical loading conditions in tension and torsion is calculated based on these results a failure criterion is formulated along with a procedure for the mechanical integrity analysis of SCSi microstructures of arbitrary shape and loading conditions.
  • Keywords
    crack-edge stress field analysis; crystal microstructure; elemental semiconductors; finite element analysis; fracture mechanics; silicon; tensile testing; torsion; Si; cracks; critical loading conditions; crystal silicon microstructures; failure condition; finite element model; fracture mechanics parameters; mechanical integrity analysis; micromechanical torsional experiments; sharp notch; stress field; tensile experiments; uniaxial testpieces; vicinity; Anisotropic magnetoresistance; Chemicals; Crystal microstructure; Etching; Failure analysis; Mechanical systems; Micromechanical devices; Silicon; Tensile stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
  • Print_ISBN
    0-7803-7066-X
  • Type

    conf

  • DOI
    10.1109/DTIP.2003.1287062
  • Filename
    1287062