• DocumentCode
    410249
  • Title

    High temperature ultrasonic transducers for monitoring of micro-molding

  • Author

    Kobayashi, M. ; Jen, C.-K. ; Corbeil, C. ; Ono, Y. ; Hébert, H. ; Derdouri, A.

  • Author_Institution
    Dept. of ECE, McGill Univ., Montreal, Que., Canada
  • Volume
    1
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    693
  • Abstract
    Thick film (90μm) piezoelectric ceramic ultrasonic transducers (UTs) have been successfully deposited on a barrel and a mold insert of a micro-molding machine by a sol-gel spray technique. The ball-milled bismuth titanate fine powders are dispersed into PZT solution to achieve the gel. The gel is then sprayed onto the substrate at room temperature. The films with desired thickness have been obtained through multilayer coating approach. Piezoelectricity is achieved using a corona discharge poling method. These UTs can operate at more than 500°C. The center frequency of ultrasound generated is 13MHz and 6dB bandwidth is 13MHz. In the pulse/echo mode the ultrasonic signals have a signal to noise ratio of more than 30dB. The ability of these UTs to monitor the polymer properties in real-time at the barrel and the mold insert of the micro-molding machine during processing is demonstrated.
  • Keywords
    bismuth compounds; lead compounds; moulding; piezoceramics; piezoelectricity; sol-gel processing; thin films; ultrasonic transducers; 13 MHz; 293 to 298 K; 90 micron; BiTiO3-PbZrO3TiO3; BiTiO3-PZT; PZT solution; ball milled bismuth titanate fine powders; center frequency; corona discharge poling method; micro molding machine; multilayer coating approach; piezoelectric ceramic ultrasonic transducers; piezoelectricity; polymer properties; pulse/echo mode; room temperature; signal to noise ratio; sol-gel spray technique; thick film; ultrasonic signals; Bismuth; Ceramics; Monitoring; Powders; Spraying; Substrates; Temperature; Thick films; Titanium compounds; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293496
  • Filename
    1293496