Packaging of image sensor devices for camera module analysis applications

Production of image sensor devices has increased dnunatically in recent years due to wide scale adoption of camera modules in mobile phones. It is expected that over 150M camera modules will be shipped in mobile phones in 2004. The packaging of an image sensor in a camera module presents several unique engineering challenges. Miterials selection, facilities control, assembly process, and image test are all areas where technology is rapidly developing. This paper will focus on current challenges, and highlight several areas where advances in research and development are needed.