• DocumentCode
    416033
  • Title

    Fast active alignment in photonics device packaging

  • Author

    Guo, Jingyan ; Heyler, Randy

  • Author_Institution
    Newport Corp., Irvine, CA, USA
  • Volume
    1
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    813
  • Abstract
    Of the many areas that are being addressed to reduce packaging costs in photonics, the process of aligning and attaching fibers and micro-optical components in the package is still regarded as one of the most expensive and time consuming. This paper reports on recent work in significantly reducing the overall cycle time for active optical alignment, utilizing a combination of modified automation algorithms and upgraded firmware and software on existing automation tools. A novel "fast alignment" technology is introduced and cycle time reductions of between 60% and 80% are reported for several relevant applications, including direct coupling with a lensed fiber and indirect coupling with a ball lens and a fiber. The cycle time effects of coupling geometry, initial process set-up conditions, and other process parameter sensitivities are also discussed.
  • Keywords
    joining processes; microassembling; micropositioning; optical fibres; optoelectronic devices; semiconductor device packaging; assembly; ball lens indirect coupling; coupling geometry; fast active alignment; fiber alignment; fiber attachment; fully automated machine vision; lensed fiber direct coupling; optical alignment cycle time reduction; photonics device packaging; Automation; Costs; Joining processes; Microoptics; Microprogramming; Optical fiber devices; Optical sensors; Packaging; Photonics; Software algorithms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1319430
  • Filename
    1319430