Experimental validation of hygro/thermo-mechanical simulations for multi-material polymer structures [IC packaging applications]

Author

Kirk, J.J. ; Tor, J.L. ; Guven, I. ; Madenci, E. ; Merto, A. ; Kutlu, Z.

Author_Institution

AME Dept., Arizona Univ., Tucson, AZ, USA

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

883

Abstract

By comparing against in-house experimental measurements, this study evaluates the numerical simulations of hygro/thermo-mechanical deformations in polymer structures commonly used in electronic packages The simulations are achieved by using the finite element method (FEM). Two different material characterization techniques are utilized for displacements and/or strains due to both moisture and thermal loading.

Keywords

deformation; finite element analysis; integrated circuit packaging; materials testing; moisture; plastic packaging; polymers; sorption; swelling; thermal stresses; FEM; IC packaging; deformations; differential swelling; displacements; electronic packages; hygro/thermo-mechanical simulations; interfacial delamination; moisture; moisture absorption/desorption induced failures; multimaterial polymer structures; solder reflow process; strains; thermal loading; thermal stresses; Capacitive sensors; Deformable models; Electronic packaging thermal management; Finite element methods; Integrated circuit packaging; Moisture; Numerical simulation; Polymers; Thermal loading; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319441

Filename

1319441