• DocumentCode
    416069
  • Title

    Fully embedded LTCC spiral inductors incorporating air cavity for high Q-factor and SRF

  • Author

    Eun, K.C. ; Lee, Y.C. ; Lee, J.W. ; Song, M.-S. ; Park, C.S.

  • Author_Institution
    Adv. Radio Frequency Res. Group, ETRI, Taejeon, South Korea
  • Volume
    1
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    1101
  • Abstract
    In this paper, a new fully-embedded LTCC spiral inductor is proposed by incorporating an air cavity between the spiral and ground plane for high quality factor (Q-factor) and high self-resonant frequency (SRF). The disadvantage of fully embedded structure without an air cavity is the reduction of size efficiency in the RF system, since its structure needs a lot of layers to decrease parasitic capacitance between the spiral and ground plane for high Q-factor and SRF. The air cavity employed under the spiral reduces the shunt parasitic capacitance of the inductor, and results in high Q-factor and high SRF of the embedded inductors. The measured results of the optimized spiral inductor with the embedded air cavity show a maximum Q of 51 and SRF of 9.1 GHz, while those of the conventional spiral inductor describe a maximum Q of 43 and SRF of 8 GHz with effective inductance of 2.7 nH.
  • Keywords
    Q-factor; capacitance; ceramic packaging; inductors; radiofrequency integrated circuits; air cavity; fully embedded LTCC spiral inductors; high quality factor; high self-resonant frequency; low loss LTCC dielectric; optimized spiral inductor; parasitic capacitance; size efficiency; Dielectric losses; Inductors; Integrated circuit packaging; Low-noise amplifiers; MMICs; Parasitic capacitance; Q factor; Radio frequency; Silver; Spirals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1319477
  • Filename
    1319477