• DocumentCode
    432329
  • Title

    3D finite element modeling of obliquely oriented piezocomposite materials and transducer arrays

  • Author

    Li, Wei ; Gilmore, James M. ; Bennett, Frederick Jay

  • Author_Institution
    SonoSite. Inc., Bothell, WA, USA
  • Volume
    3
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    1666
  • Abstract
    In this paper, a 3D FEA model is proposed to study the obliquely oriented piezocomposite array, where the transducer is formed of it 2-2 composite material in which the pattern of the composite material is oriented at an oblique angle to the elevation axis of the transducer array elements. Such obliquely oriented piezocomposite, as stated in US Patent 6,104,126, offers additional benefits such as easier in-process dimension registration, mechanical flexibility, and performance improvement by strongly suppressing the lateral resonance modes when compared with the conventional 2-2 composite with parallel or orthogonal orientation. A 3D FEA model using the commercially available PZFlex package has been developed to simulate the obliquely oriented piezocomposite material and transducer array. Experimental data from obliquely oriented piezocomposite materials of different orientation angles have been taken and compared with the model predictions. The 3D FEA modeling results showed very good agreement with the experimental data.
  • Keywords
    composite materials; finite element analysis; piezoelectric materials; piezoelectric transducers; ultrasonic transducer arrays; 3D finite element modeling; composite material oblique orientation; in-process dimension registration; lateral resonance mode suppression; obliquely oriented piezocomposite; obliquely oriented piezocomposite materials; piezocomposite array; transducer arrays; Acoustic arrays; Acoustic transducers; Composite materials; Field emitter arrays; Finite element methods; Packaging; Pattern analysis; Predictive models; Resonance; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1418143
  • Filename
    1418143