Functional integration in active IPEM by using a planar integration technology

Author

Liang, Zhenxian ; van Wyk, J.D.

Author_Institution

Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

1

fYear

2005

fDate

6-10 March 2005

Firstpage

375

Abstract

A technology, incorporating the multi-functions in a power switching IPEM, has been developed. The functional integration in this module is realized in an integrated structure by using an integrated process module. It is notable that the power switches are interconnected by planar metallization, so called embedded power. The capacitors are fabricated by embedding high ε ceramic chips. The current sensor is integrated in the structure by embedding a planar coil. Large area planar metallization interconnection allows double-sided cooling. In addition, such power electronics system-in-package (SiP) can be manufactured in integrated planar processes, analogue to microcircuits manufacturing process.

Keywords

capacitors; ceramics; coils; electric sensing devices; integrated circuit interconnections; integrated circuit manufacture; integrated circuit metallisation; integrated circuit packaging; power electronics; ε ceramic chips; active IPEM; current sensor; double-sided cooling; integrated power electronic modules; integrated process module; microcircuits manufacturing process; planar integration technology; planar metallization interconnection; power electronics system-in-package; power switches; power switching IPEM; Bonding; Ceramics; Chip scale packaging; Electronics cooling; Integrated circuit interconnections; Manufacturing processes; Metallization; Power electronics; Power system interconnection; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE

Print_ISBN

0-7803-8975-1

Type

conf

DOI

10.1109/APEC.2005.1452956

Filename

1452956