A 3D wideband package solution using MCM-D BCB technology for tile TR module

This paper describes the works performed on a solution of packaging dedicated to 3D TR modules in the 2-20 GHz frequency range. The proposed solution is based on a nonhermetic architecture involving organic and BCB substrates. The studied key bricks relative to assembly, vertical interconnections, passives integration are described and results consecutive to electrical and environmental evaluation are presented. A 3D TR module demonstrator taking benefit from the key bricks evaluated through test vehicles has been realised and its performances measured when submitted to airborne environmental constraints.