• DocumentCode
    455578
  • Title

    Elevated Microresonators for Investigating the Effect of Air Damping

  • Author

    Lijie Li ; Brown, G. ; Uttamchandani, Deepak

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Univ. of Strathclyde, Glasgow
  • fYear
    2006
  • fDate
    28-28 April 2006
  • Firstpage
    251
  • Lastpage
    256
  • Abstract
    It is known that the dissipative damping force due to the air film trapped between the bottom of surface micromachined resonators and the substrate on which they are fabricated decreases in magnitude as the separation between the two increases. In order to further investigate this effect and compare experimental findings with theory, a new test device that enables modulation of the damping interaction between a surface micromachined resonator and the substrate has been fabricated. The device, fabricated by the PolyMUMPs process, consists of a surface micromachined polysilicon microresonator, which is elevated out of the plane of the substrate with the assistance of a bimorph beam. The resonator-to-substrate separation of the elevated resonator can be varied by changing the temperature of the bimorph beam. Q factors for different separations have been measured. Experimental results show that the elevated microresonators have Q values which are 65% higher than similar microresonators fabricated close to the substrates. These experimental findings show good agreement with the theoretical model of damping used.
  • Keywords
    Q-factor; damping; micromechanical resonators; Q-factors; air damping; damping force dissipation; microresonators; polymump process; resonator-to-substrate separation; surface micromachined resonators;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    MEMS Sensors and Actuators, 2006. The Institution of Engineering and Technology Seminar on
  • Conference_Location
    London
  • ISSN
    0537-9989
  • Print_ISBN
    0-86341-627-6
  • Type

    conf

  • Filename
    1662196