DocumentCode
469358
Title
Molecular Dynamics Study on Thermal Performance of CNT-array-Thermal Interface Material
Author
Zhang, Kai ; Fan, Haibo ; Yuen, Matthew M F
Author_Institution
Hong Kong Univ. of Sci. & Technol., Kowloon
fYear
2006
fDate
11-14 Dec. 2006
Firstpage
1
Lastpage
4
Abstract
Carbon nanotubes (CNT) are an attractive candidate to form thermal interface material (TIM) and improve the thermal management performance of microelectronic packages. In this paper, thermal performance of CNT-array-TIM was predicted by nonequilibrium molecular dynamics simulation. The ab initio forcefield COMPASS (Condensed-phase Optimized Molecular Potentials for Atomistic Simulation Studies) was adopted to model interatomic chemical bonding and non-bonding potential energy. A constant heat flux was imposed on the system and the resulting temperature gradient was calculated to obtain the thermal conductivity. The effects of the diameter of CNT and the temperature on the thermal conductivity of CNT-array-TIM were studied. It was demonstrated that significantly drop of thermal conductivity of CNT-array-TIM occured with the temperature increases up to room temperature. However, it will not reduce much with the temperature further increase. It was also found that the thermal conductivity of CNT-array-TIM increased with the increased diameter of the armchair CNT.
Keywords
bonds (chemical); carbon nanotubes; molecular dynamics method; thermal conductivity; C; carbon nanotubes; heat flux; interatomic chemical bonding; nonequilibrium molecular dynamics simulation; potential energy; temperature gradient; thermal conductivity; thermal interface material; Bonding forces; Carbon nanotubes; Chemicals; Microelectronics; Organic materials; Packaging; Predictive models; Temperature; Thermal conductivity; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location
Kowloon
Print_ISBN
978-1-4244-0834-4
Electronic_ISBN
978-1-4244-0834-4
Type
conf
DOI
10.1109/EMAP.2006.4430586
Filename
4430586
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