• DocumentCode
    469358
  • Title

    Molecular Dynamics Study on Thermal Performance of CNT-array-Thermal Interface Material

  • Author

    Zhang, Kai ; Fan, Haibo ; Yuen, Matthew M F

  • Author_Institution
    Hong Kong Univ. of Sci. & Technol., Kowloon
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Carbon nanotubes (CNT) are an attractive candidate to form thermal interface material (TIM) and improve the thermal management performance of microelectronic packages. In this paper, thermal performance of CNT-array-TIM was predicted by nonequilibrium molecular dynamics simulation. The ab initio forcefield COMPASS (Condensed-phase Optimized Molecular Potentials for Atomistic Simulation Studies) was adopted to model interatomic chemical bonding and non-bonding potential energy. A constant heat flux was imposed on the system and the resulting temperature gradient was calculated to obtain the thermal conductivity. The effects of the diameter of CNT and the temperature on the thermal conductivity of CNT-array-TIM were studied. It was demonstrated that significantly drop of thermal conductivity of CNT-array-TIM occured with the temperature increases up to room temperature. However, it will not reduce much with the temperature further increase. It was also found that the thermal conductivity of CNT-array-TIM increased with the increased diameter of the armchair CNT.
  • Keywords
    bonds (chemical); carbon nanotubes; molecular dynamics method; thermal conductivity; C; carbon nanotubes; heat flux; interatomic chemical bonding; nonequilibrium molecular dynamics simulation; potential energy; temperature gradient; thermal conductivity; thermal interface material; Bonding forces; Carbon nanotubes; Chemicals; Microelectronics; Organic materials; Packaging; Predictive models; Temperature; Thermal conductivity; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430586
  • Filename
    4430586