DocumentCode
471628
Title
MRI induced heating of pacemaker leads: effect of temperature probe positioning and pacemaker placement on lead tip heating and local SAR
Author
Mattei, E. ; Calcagnini, G. ; Triventi, M. ; Censi, F. ; Bartolini, P. ; Kainz, W. ; Bassen, H.
Author_Institution
Dept. of Technol. & Health, Italian Nat. Inst. of Health, Roma
fYear
2006
fDate
Aug. 30 2006-Sept. 3 2006
Firstpage
1889
Lastpage
1892
Abstract
The radio frequency field used in magnetic resonance imaging (MRI) procedures leads to temperature and local absorption rate (SAR) increase for patients with implanted pacemakers (PM). In this work a methodological approach for temperature and SAR measurements using fluoroptic probes is presented. Experimental measures show how the position of temperature probes affects the temperature and SAR value measured at the lead tip. The transversal contact between the active portion of the probe and the lead tip is the configuration associated with the highest values for temperature and SAR, whereas other configurations may lead to an underestimation close to 11% and 70% for temperature and SAR, respectively. In addition measurements were performed on a human-shaped phantom inside a real MRI system, in order to investigate the effect of the PM placement and of the lead geometry on heating and local SAR
Keywords
biomedical MRI; biomedical equipment; biomedical measurement; biothermics; pacemakers; phantoms; probes; thermometers; MRI induced heating; SAR measurements; fluoroptic thermometry probes; human-shaped phantom; lead tip heating; local absorption rate; magnetic resonance imaging; pacemaker leads; radio frequency field; temperature measurements; temperature probe positioning; Electromagnetic wave absorption; Heating; Magnetic field measurement; Magnetic resonance imaging; Pacemakers; Position measurement; Probes; Radio frequency; Specific absorption rate; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location
New York, NY
ISSN
1557-170X
Print_ISBN
1-4244-0032-5
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2006.260068
Filename
4462147
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