• DocumentCode
    472758
  • Title

    PASPAC (Planaraized Al/Silicide/Poly Si with Self Aligned Contact) with Low Contact Resistance and High Reliability in CMOS LSIs

  • Author

    Kakumu, Masakazu ; Hashimoto, Kazuhiko ; Matsunaga, Jun´Ichi ; Asami, Tetsuya

  • Author_Institution
    Semiconductor Device Enginnering Laboratory Toshiba Corporation 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan
  • fYear
    1987
  • fDate
    22-23 May 1987
  • Firstpage
    77
  • Lastpage
    78
  • Keywords
    Contact resistance; Degradation; Filling; Lithography; Metallization; Ohmic contacts; Optical films; Optical mixing; Silicides; Sputter etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1987. Digest of Technical Papers. Symposium on
  • Conference_Location
    Karuizawa, Japan
  • Type

    conf

  • Filename
    4480430
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=472758