DocumentCode
472931
Title
Multilevel Metallization Technology for VLSIs
Author
Okabayashi, Hidekazu
Author_Institution
Microelectronics Research Labs. NEC Corp. 4-1-1 Miyazaki, Miyamae-ku, Kawasaki 213, Japan
fYear
1984
fDate
10-12 Sept. 1984
Firstpage
20
Lastpage
23
Keywords
Capacitance; Conductivity; Integrated circuit interconnections; Metallization; Planarization; Plasma temperature; Polyimides; Sputter etching; Sputtering; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1984. Digest of Technical Papers. Symposium on
Conference_Location
San Diego, CA, USA
Print_ISBN
4-930813-08-5
Type
conf
Filename
4480680
Link To Document