• DocumentCode
    472931
  • Title

    Multilevel Metallization Technology for VLSIs

  • Author

    Okabayashi, Hidekazu

  • Author_Institution
    Microelectronics Research Labs. NEC Corp. 4-1-1 Miyazaki, Miyamae-ku, Kawasaki 213, Japan
  • fYear
    1984
  • fDate
    10-12 Sept. 1984
  • Firstpage
    20
  • Lastpage
    23
  • Keywords
    Capacitance; Conductivity; Integrated circuit interconnections; Metallization; Planarization; Plasma temperature; Polyimides; Sputter etching; Sputtering; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1984. Digest of Technical Papers. Symposium on
  • Conference_Location
    San Diego, CA, USA
  • Print_ISBN
    4-930813-08-5
  • Type

    conf

  • Filename
    4480680