• DocumentCode
    473621
  • Title

    The effect of bonding conditions on the electrical properties of solder joints fabricated by mechanical caulking using reflowed Sn bumps

  • Author

    Yang, Ju-heon ; Kim, Young-Ho ; Moon, Jae-Seung ; Lee, Won-Jong

  • Author_Institution
    Department of Materials Science & Engineering, Hanyang Univ., Korea
  • fYear
    2007
  • fDate
    19-22 Nov. 2007
  • Firstpage
    1
  • Lastpage
    33
  • Keywords
    Bonding; Mechanical factors; Soldering; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
  • Conference_Location
    Daejeon, Korea
  • Print_ISBN
    978-1-4244-1909-8
  • Electronic_ISBN
    978-1-4244-1910-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2007.4510303
  • Filename
    4510303
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=473621