• DocumentCode
    473622
  • Title

    Transient current modeling & power delivery analysis for next gen chipset core

  • Author

    Tan, Fern Nee ; Chai, Aissa ; Pang, Sze Geat ; Sasidaran, Dhinesh ; Ng, Kiat Hong ; Deo, Song Chin ; Lee, Chee Siong ; Lim, Jin Sean ; Ooi, Poey Ling ; Loke, Chee Ngai ; Lim, Meng Chong

  • fYear
    2007
  • fDate
    19-22 Nov. 2007
  • Firstpage
    1
  • Lastpage
    23
  • Keywords
    Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
  • Conference_Location
    Daejeon, Korea
  • Print_ISBN
    978-1-4244-1909-8
  • Electronic_ISBN
    978-1-4244-1910-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2007.4510311
  • Filename
    4510311
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=473622