• DocumentCode
    473623
  • Title

    Effects of annealing and electromigration on intermetallic compound formation of Cu pillar bump

  • Author

    Kim, Byoung-Joon ; Lim, Gi-Tae ; Lee, Jang-Hee ; Kim, Jaedong ; Lee, Kiwook ; Park, Young-Bae ; Joo, Young-Chang

  • Author_Institution
    Dept. of Materials Science & Engineering, Seoul National Univ., Korea
  • fYear
    2007
  • fDate
    19-22 Nov. 2007
  • Firstpage
    1
  • Lastpage
    19
  • Keywords
    Annealing; Electromigration; Intermetallic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
  • Conference_Location
    Daejeon, Korea
  • Print_ISBN
    978-1-4244-1909-8
  • Electronic_ISBN
    978-1-4244-1910-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2007.4510319
  • Filename
    4510319
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=473623