DocumentCode
474542
Title
Accurate and analytical statistical spatial correlation modeling for VLSI DFM applications
Author
Liu, Jui Hsiang ; Tsai, Ming Feng ; Chen, Lumdo ; Chen, Charlie Chung Ping
Author_Institution
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
fYear
2008
fDate
8-13 June 2008
Firstpage
694
Lastpage
697
Abstract
With the significant advancement of statistical timing and yield analysis algorithms, there is a strong need for accurate and analytical spatial correlation models. In this paper, we propose a novel spatial correlation modeling method not only can capture the general spatial correlation relationship but also can generate highly accurate and analytical models. Our method, based on Singular Value Decomposition (SVD), can generate sequences of polynomial weighted by the singular values. Experimental results from foundry measurement data show that our proposed approach is 5X accuracy improvement over several distance based spatial correlation modeling methods.
Keywords
VLSI; correlation methods; design for manufacture; integrated circuit design; integrated circuit yield; polynomials; singular value decomposition; statistical analysis; VLSI DFM applications; accurate statistical spatial correlation modeling; analytical statistical spatial correlation modeling; design for manufacturing; foundry measurement data; singular value decomposition; statistical timing algorithms; yield analysis algorithms; Algorithm design and analysis; Analytical models; Design for manufacture; Fitting; Foundries; Robustness; Semiconductor process modeling; Singular value decomposition; Timing; Very large scale integration; Process Variation; SSTA; Spatial Correlation;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location
Anaheim, CA
ISSN
0738-100X
Print_ISBN
978-1-60558-115-6
Type
conf
Filename
4555908
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