DocumentCode
48127
Title
Machine Vision-Based Defect Detection in IC Images Using the Partial Information Correlation Coefficient
Author
Chien-Chih Wang ; Jiang, Bernard C. ; Jing-You Lin ; Chien-Cheng Chu
Author_Institution
Ming Chi Univ. of Technol., Taipei, Taiwan
Volume
26
Issue
3
fYear
2013
fDate
Aug. 2013
Firstpage
378
Lastpage
384
Abstract
The normalized cross correlation coefficient is a prevalent pattern-matching algorithm in machine vision for industrial inspections. Despite its common use, there are problems with practical applications. For instance, false alarms occur since it is highly sensitive to environmental changes or inspection equipment, not to mention it requires complex calculations. This paper proposes the partial information correlation coefficient (PICC) method to improve the traditional normalized cross correlation coefficient (TNCCC). The PICC uses the technique of significant points to calculate the correlation coefficient. An experiment is also conducted to demonstrate the application through many image samples from the IC industry, such as PCBs, BGAs, and ICs. The results show that the PICC can effectively reduce false alarms in defect detection.
Keywords
computer vision; correlation methods; flaw detection; image recognition; inspection; integrated circuit manufacture; pattern matching; IC industry; PICC; TNCCC; defect detection; false alarms; industrial inspections; machine vision; partial information correlation coefficient; pattern matching algorithm; traditional normalized cross correlation coefficient; Defect detection; IC industry; image processing; pattern matching;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2013.2261566
Filename
6513319
Link To Document