An effective ESD protection system in the Back end (BE) semiconductor manufacturing facility

ESD protection measures in the Back-end (BE) semiconductor manufacturing environment have become more and more critical. This is due to the increased sensitivity to ESD damage of microchips from the decreasing structural geometries and increased integration density. However, the requirements for BE ESD protection have not been well understood in the semiconductor industry. Some of the commonly observed evidence of this are overkill ESD protection measures with ineffective end results. This paper provides an overview on an effective ESD protection system implementation in a BE semiconductor manufacturing facility.