• DocumentCode
    505500
  • Title

    Thermal simulation and package investigation of wireless gas sensors microsystems

  • Author

    Paoli, Andrea ; Seminara, Lucia ; Caviglia, Daniele D. ; Garibbo, Alessandro ; Valle, Maurizio

  • Author_Institution
    Dept. of Biophys. & Electron. Eng., Univ. of Genoa, Genoa, Italy
  • fYear
    2009
  • fDate
    7-9 Oct. 2009
  • Firstpage
    66
  • Lastpage
    69
  • Abstract
    Gas sensor arrays based on metal oxides operating at high temperature are commonly used in many application fields. They can operate on different principles and each sensor may show very different responses to the individual gases in the environment. Data coming from the array can be merged for reliable gas detection. One point which is common to the different sensors types is that the atmosphere to be sensed must flow on or through the sensor itself. This work investigates air flows in gas sensor packages, and proposes a new package to improve gas exchange through natural convection, aiming to allow the gas detection in the case of very small gas concentrations. The study is based on multiphysics finite element method simulations using a commercial software tool.
  • Keywords
    chemical variables measurement; finite element analysis; gas sensors; micromechanical devices; packaging; sensor arrays; software tools; air flows; finite element method; gas detection; gas sensor arrays; metal oxides; natural convection; package investigation; small gas concentrations; software tool; thermal simulation; wireless gas sensors microsystems; Apertures; Atmosphere; Chemical analysis; Chemical sensors; Gas detectors; Gases; Packaging; Sensor arrays; Temperature sensors; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
  • Conference_Location
    Leuven
  • Print_ISBN
    978-1-4244-5881-3
  • Type

    conf

  • Filename
    5340077