• DocumentCode
    506663
  • Title

    Research on modeling technology for dynamic modular design

  • Author

    Xiao, Yanqiu ; Luo, Guofu ; Ma, Jun ; Li, Hao

  • Author_Institution
    Sch. of Mech. & Electron. Eng., Zhengzhou Univ. of Light Ind., Zhengzhou, China
  • Volume
    3
  • fYear
    2009
  • fDate
    20-22 Nov. 2009
  • Firstpage
    681
  • Lastpage
    685
  • Abstract
    Modular design is a dynamic process and obtains rational architecture of product family continuously. It needs modeling technology to prepare skeleton for evolution of product system, and adapt to the dynamic characteristic. In this paper, a joint modeling technique is proposed to prepare for evolution of product system, which considers design process as one part of the product system. According to close-loop process of modular design, modeling techniques are analysed and a joint modeling approach is advanced. By comparing interface propagation with network, correlative information is organized in the form of network, and it is collected into a tri-view model. Then collaborative model is given by modular layouts and model of product family is established. In this way, a two-way channel for application and optimization of modular scheme is taken shape. Finally, a case is presented to illustrate the application of this approach, which proved the effectiveness of this approach.
  • Keywords
    computer integrated manufacturing; product design; close-loop process; design process; dynamic modular design; interface propagation; joint modeling; modeling technology; modular layout; product family; product system evolution; rational architecture; tri-view model; two-way channel; Collaboration; Design engineering; Design methodology; Design optimization; Electronics industry; Industrial electronics; Joints; Process design; Product design; Skeleton; constraint network; correlative information; dynamic modular design; joint modeling; product system;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Computing and Intelligent Systems, 2009. ICIS 2009. IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-4754-1
  • Electronic_ISBN
    978-1-4244-4738-1
  • Type

    conf

  • DOI
    10.1109/ICICISYS.2009.5358093
  • Filename
    5358093