• DocumentCode
    50690
  • Title

    Switching of Dipole Coupled Multiferroic Nanomagnets in the Presence of Thermal Noise: Reliability of Nanomagnetic Logic

  • Author

    Fashami, Mohammad Salehi ; Munira, Kamaram ; Bandyopadhyay, Supriyo ; Ghosh, Avik W. ; Atulasimha, Jayasimha

  • Author_Institution
    Dept. of Mech. & Nucl. Eng., Virginia Commonwealth Univ., Richmond, VA, USA
  • Volume
    12
  • Issue
    6
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    1206
  • Lastpage
    1212
  • Abstract
    The stress-induced switching behavior of a multiferroic nanomagnet, dipole coupled to a hard nanomagnet, is numerically studied by solving the stochastic Landau-Lifshitz-Gilbert equation for a single-domain macrospin state. Different factors were found to affect the switching probability in the presence of thermal noise at room temperature: 1) dipole coupling strength, 2) stress levels, and 3) stress withdrawal rates (ramp rates). We report that the thermal broadening of the magnetization distribution causes large switching error rates. This could render nanomagnetic logic schemes that rely on dipole coupling to perform Boolean logic operations impractical whether they are clocked by stress or field or other means.
  • Keywords
    logic devices; magnetic switching; magnetisation; magnetoelectronics; multiferroics; nanomagnetics; permanent magnets; reliability; stochastic processes; thermal noise; Boolean logic operations; dipole coupled multiferroic nanomagnet switching; dipole coupling strength; hard nanomagnet; magnetization distribution; nanomagnetic logic reliability; nanomagnetic logic schemes; single-domain macrospin state; stochastic Landau-Lifshitz-Gilbert equation; stress levels; stress withdrawal rates; stress-induced switching behavior; switching error rates; switching probability; thermal broadening; thermal noise; Couplings; Magnetization; Magnetomechanical effects; Perpendicular magnetic anisotropy; Stress; Switches; Landau–Lifshitz–Gilbert (LLG) equation; nanomagnetic logic (NML); reliability; straintronics–spintronics; thermal noise;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1536-125X
  • Type

    jour

  • DOI
    10.1109/TNANO.2013.2284777
  • Filename
    6632926