• DocumentCode
    509951
  • Title

    Enhancing lifetime and security of PCM-based Main Memory with Start-Gap Wear Leveling

  • Author

    Qureshi, Moinuddin K. ; Karidis, John ; Franceschini, Michele ; Srinivasan, Vijayalakshmi ; Lastras, Luis ; Abali, Bulent

  • Author_Institution
    T.J. Watson Res. Center, IBM Res., Yorktown Heights, NY, USA
  • fYear
    2009
  • fDate
    12-16 Dec. 2009
  • Firstpage
    14
  • Lastpage
    23
  • Abstract
    Phase Change Memory (PCM) is an emerging memory technology that can increase main memory capacity in a cost-effective and power-efficient manner. However, PCM cells can endure only a maximum of 107-108 writes, making a PCM based system have a lifetime of only a few years under ideal conditions. Furthermore, we show that non-uniformity in writes to different cells reduces the achievable lifetime of PCM system by 20×. Writes to PCM cells can be made uniform with Wear-Leveling. Unfortunately, existing wear-leveling techniques require large storage tables and indirection, resulting in significant area and latency overheads. We propose Start-Gap, a simple, novel, and effective wear-leveling technique that uses only two registers. By combining Start-Gap with simple address-space randomization techniques we show that the achievable lifetime of the baseline 16 GB PCM-based system is boosted from 5% (with no wear-leveling) to 97% of the theoretical maximum, while incurring a total storage overhead of less than 13 bytes and obviating the latency overhead of accessing large tables. We also analyze the security vulnerabilities for memory systems that have limited write endurance, showing that under adversarial settings, a PCM-based system can fail in less than one minute. We provide a simple extension to Start-Gap that makes PCM-based systems robust to such malicious attacks.
  • Keywords
    phase change memories; security of data; PCM-based main memory system; address-space randomization techniques; latency overhead; lifetime enhancement; phase change memory; security vulnerabilities; start-gap wear leveling; storage overhead; write endurance; Costs; Delay; Failure analysis; Phase change materials; Phase change memory; Random access memory; Robustness; Security; Semiconductor device reliability; Semiconductor memory; Endurance; Phase Change Memory; Wear Leveling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microarchitecture, 2009. MICRO-42. 42nd Annual IEEE/ACM International Symposium on
  • Conference_Location
    New York, NY
  • ISSN
    1072-4451
  • Print_ISBN
    978-1-60558-798-1
  • Type

    conf

  • Filename
    5375309