DocumentCode
509968
Title
Extending the effectiveness of 3D-stacked DRAM caches with an adaptive multi-queue policy
Author
Loh, Gabriel H.
Author_Institution
Coll. of Comput., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2009
fDate
12-16 Dec. 2009
Firstpage
201
Lastpage
212
Abstract
3D-integration is a promising technology to help combat the ??memory wall?? in future multi-core processors. Past work has considered using 3D-stacked DRAM as a large last-level cache (LLC). While significant performance benefits can be gained with such an approach, there remain additional opportunities beyond the simple integration of commodity DRAM chips. In this work, we leverage the hardware organization typical of DRAM architectures to propose new cache management policies that would otherwise not be practical for standard SRAM-based caches. We propose a cache where each set is organized as multiple logical FIFO or queue structures that simultaneously provide performance isolation between threads as well as reduce the number of entries occupied by dead lines. Our results show that beyond the simplistic approach of stacking DRAM as cache, such tightly-integrated 3D architectures enable new opportunities for optimizing and improving system performance.
Keywords
DRAM chips; cache storage; memory architecture; queueing theory; 3D-integration; 3D-stacked DRAM caches; adaptive multiqueue policy; cache management policies; large last-level cache; memory wall; multicore processors; multiple logical FIFO; queue structures; standard SRAM-based caches; Computer architecture; Educational institutions; Hardware; Microprocessors; Multicore processing; Permission; Random access memory; Stacking; Standards organizations; Design; Performance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microarchitecture, 2009. MICRO-42. 42nd Annual IEEE/ACM International Symposium on
Conference_Location
New York, NY
ISSN
1072-4451
Print_ISBN
978-1-60558-798-1
Type
conf
Filename
5375363
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