• DocumentCode
    509992
  • Title

    Multiple clock and Voltage Domains for chip multi processors

  • Author

    Rotem, Efraim ; Mendelson, Avi ; Ginosar, Ran ; Weiser, Uri

  • Author_Institution
    Intel Corp., Israel
  • fYear
    2009
  • fDate
    12-16 Dec. 2009
  • Firstpage
    459
  • Lastpage
    468
  • Abstract
    Power and thermal are major constraints for delivering compute performance in high-end CPU and are expected to be so in the future. CMP is becoming important by delivering more compute performance within the power constraints. Dynamic Voltage and Frequency Scaling (DVFS) has been studied in past work as a mean to increase save power and improving the overall processor´s performance while meeting the total power and/or thermal constraints. For such systems, power delivery limitations are becoming a significant practical design consideration, unfortunately this aspect of the design was almost ignored by many research works. This paper explores the various possible topologies to build a high end multi-core CPU and the available policies that maximize performance within the set of physical limitations. It evaluates single and multiple voltage and frequency domains and introduces a new clustered topology, grouping several cores together. A hybrid model, using measurements of a real CPU, cycle accurate simulator and an analytical model is introduced. The results presented indicate that considering power delivery limitations diverts the conclusions when such limitations are ignored. This paper shows that a single power domain topology performs up to 30% better than multiple power domains on light-threaded workload. In the fully threaded application the results divert. Clustered topology performs well for any number of threads.
  • Keywords
    clocks; microprocessor chips; network topology; power aware computing; chip multi processors; clustered topology; dynamic voltage and frequency scaling; multi-core CPU; multiple clock; voltage domains; Analytical models; Clocks; Dynamic voltage scaling; Frequency; Permission; Power system dynamics; Research and development; Thermal force; Topology; Yarn; Chip Multi Processor; Clock domains; DVFS; Power management; Voltage domain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microarchitecture, 2009. MICRO-42. 42nd Annual IEEE/ACM International Symposium on
  • Conference_Location
    New York, NY
  • ISSN
    1072-4451
  • Print_ISBN
    978-1-60558-798-1
  • Type

    conf

  • Filename
    5375435