• DocumentCode
    509998
  • Title

    Scalable arbitration of partitioned bus interconnection networks in 3D-IC systems

  • Author

    Ireland, Kelli ; Jezak, Joseph ; Levitan, Steven ; Chiarulli, Donald

  • Author_Institution
    Comput. Eng. Dept., Univ. of Pittsburgh, Pittsburgh, PA, USA
  • fYear
    2009
  • fDate
    12-12 Dec. 2009
  • Firstpage
    77
  • Lastpage
    82
  • Abstract
    In this paper, we describe a scalable interconnection network architecture intended for very large multicore processors implemented on stacked chip 3D integrated circuits (3D-IC). These networks provide fully interconnected, low latency, single hop performance with wiring complexity that scales linearly with the size of the network. The enabling technology for these networks is a novel, fully distributed arbitration and control algorithm that operates solely at the edges of the network without the need for any routers within the network core. This paper is focused on a description of that algorithm. We present simulation results for average, worst-case, and per-node latencies showing that our arbitration algorithm performs efficiently, scales for a wide range of partition sizes, and effectively manages highly non-uniform traffic patterns.
  • Keywords
    integrated circuit interconnections; integrated circuit layout; microprocessor chips; three-dimensional integrated circuits; 3D integrated circuit; distributed arbitration and control algorithm; partitioned bus interconnection network; scalable interconnection network architecture; very large multicore processors; Delay; Distributed control; Integrated circuit interconnections; Integrated circuit technology; Multicore processing; Multiprocessor interconnection networks; Partitioning algorithms; Telecommunication traffic; Three-dimensional integrated circuits; Wiring; Interconnection Network; Multicore; Network on Chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Network on Chip Architectures, 2009. NoCArc 2009. 2nd International Workshop on
  • Conference_Location
    New York, NY
  • Print_ISBN
    978-1-60558-774-5
  • Type

    conf

  • Filename
    5375708