• DocumentCode
    510022
  • Title

    Application of Improved BP Network in the Flaws Evaluation of Conductive Materials

  • Author

    Qingjie, Yang ; Yanfeng, Chen ; Xinhua, Mao ; Xiaohong, Kong

  • Author_Institution
    Sch. of Mechinery & Electron., Henan Inst. of Sci. & Technol., Xinxiang, China
  • Volume
    2
  • fYear
    2009
  • fDate
    7-8 Nov. 2009
  • Firstpage
    351
  • Lastpage
    354
  • Abstract
    The back-propagation (BP) network is widely recognized as a powerful training tool of the multilayer neural networks (MLNNs). Usually it suffers from a slow convergence rate and often results in local minimums, since it applies the steepest descent method to update the network weights. A variety of related algorithms have been introduced to address that problem. Levenberg-Marquardt algorithm is one of the fastest types of these algorithms. This paper presents an approximation calculation for Hesse matrix to train the neural networks when the second order item can not be omitted, and the improved algorithm is successfully used in the surface flaws evaluation of the conductive materials based on eddy current testing (ECT).
  • Keywords
    Hessian matrices; approximation theory; backpropagation; conducting materials; convergence; eddy current testing; flaw detection; gradient methods; materials science computing; materials testing; multilayer perceptrons; Hesse matrix; Levenberg-Marquardt algorithm; approximation calculation; backpropagation network; conductive materials; convergence rate; eddy current testing; multilayer neural network training; steepest descent method; surface flaws evaluation; Artificial neural networks; Biological neural networks; Computer networks; Conducting materials; Electrical capacitance tomography; Humans; Multi-layer neural network; Neural networks; Neurons; Signal processing algorithms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Artificial Intelligence and Computational Intelligence, 2009. AICI '09. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-3835-8
  • Electronic_ISBN
    978-0-7695-3816-7
  • Type

    conf

  • DOI
    10.1109/AICI.2009.471
  • Filename
    5375787