• DocumentCode
    511548
  • Title

    Strain effects on the band structure for Si nanowires

  • Author

    Nakamura, Hajime

  • Author_Institution
    Tokyo Res. Lab., IBM Res., Yamato, Japan
  • fYear
    2009
  • fDate
    26-30 July 2009
  • Firstpage
    555
  • Lastpage
    558
  • Abstract
    The present paper discusses the strain effects on the conduction and valence bands for Si nanowires using k.p Hamiltonian, where, in addition to the usual radial symmetric strains, the torsional strain, being unique to axial symmetric devices, is also studied. The radial compression/expansion, analogous with the biaxial strain in planar devices, gives linear increase/decrease in the conduction band energy whereas for valence bands, multiband-specific edge shifts and effective mass changes are discussed with effective mass ellipsoid. The torsional strain only lowers the four-fold conduction subband for [110] nanowire, which is associated with normal strain in crystal coordinate. The torsion also raises the valence band energy with no substantial changes in effective masses. For the valence band, it is also suggested that the diagonal sum for inverted effective mass nearly unchanged under strain application.
  • Keywords
    conduction bands; effective mass; elemental semiconductors; k.p calculations; nanowires; silicon; torsion; valence bands; Si; band structure; biaxial strain; conduction band energy; four-fold conduction subband; inverted effective mass; k.p Hamiltonian; multiband-specific edge shifts; nanowires; radial compression; radial expansion; strain effects; torsional strain; valence band energy; Capacitive sensors; Effective mass; Ellipsoids; Fabrication; Logic devices; Nanoelectronics; Nanotechnology Council; Nanowires; Paper technology; Tensile stress; bandstructure; nanowire; strain; torsion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2009. IEEE-NANO 2009. 9th IEEE Conference on
  • Conference_Location
    Genoa
  • ISSN
    1944-9399
  • Print_ISBN
    978-1-4244-4832-6
  • Electronic_ISBN
    1944-9399
  • Type

    conf

  • Filename
    5394741