DocumentCode
513632
Title
Effects of Non-Degenerately Doped Polysilicon on the Hot-Carrier Reliability of Tungsten Polycide Gate PMOSFETs
Author
Lou, C.L. ; Chim, W.K. ; Chan, D.S.H. ; Pan, Y.
Author_Institution
Centre for Integrated Circuit Failure Analysis and Reliability, National University of Singapore 10 Kent Ridge Crescent, Singapore 119260
fYear
1996
fDate
9-11 Sept. 1996
Firstpage
983
Lastpage
986
Abstract
Polysilicon depletion effect is observed for the non-degenerately doped Polysilicon layer of the tungsten-polycide gate of buuried-channel PMOSFETs. Lower current drive and transconductance coupled with higher subthreshold slope are observed for PMOSFETs with lower doped Polysilicon layer. The potential drop across the lower doped polysilicon layer of the PMOSFETs results in lower gate current. Consequently, PMOSFETs with lower doped polysilicon layer are more resistant to hot-carrier degradation and have higher hot-carrier lifetimes. There exists an optimum polysilicon doping concentration for tungsten-polycide devices depending on the desired electrical performances and hot-carrier reliability of the buried-channel PMOSFETs.
Keywords
Capacitance; Capacitance-voltage characteristics; Degradation; Doping; Hot carrier effects; Hot carriers; MOSFETs; Stress measurement; Transconductance; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Conference_Location
Bologna, Italy
Print_ISBN
286332196X
Type
conf
Filename
5435872
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