• DocumentCode
    513663
  • Title

    Recent Advances and Trends in SOI CMOS Technology

  • Author

    Colinge, Jean-Pierre

  • Author_Institution
    Université catholique de Louvain, Microelectronics Laboratory, Place du Levant 3, 1348 Louvain-la-Neuve, Belgium
  • fYear
    1996
  • fDate
    9-11 Sept. 1996
  • Firstpage
    935
  • Lastpage
    942
  • Abstract
    Fully depleted SOI CMOS technology is now showing decisive advantages (in contrast to incremental advantages) over bulk CMOS. Low-voltage (as low as 0.5 V), low-power (in the tens of nanowatts range) circuits operating at respectable speeds have been demonstrated. In the DRAM field, a three-fold reduction of the storage capacitor can be obtained, owing to the lower bit line capacitance, the lower access transistor leakage current and the higher soft-error immunity provided by SOI technology. High-temperature analog and digital circuits benefit from the reduced leakage current and the absence of leakage to the substrate found in SOI devices.
  • Keywords
    CMOS analog integrated circuits; CMOS digital integrated circuits; CMOS process; CMOS technology; Capacitance; Digital circuits; Image storage; Leakage current; Transistors; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
  • Conference_Location
    Bologna, Italy
  • Print_ISBN
    286332196X
  • Type

    conf

  • Filename
    5435908