• DocumentCode
    514691
  • Title

    Curvature Modal Analysis of Defective Wood Beams Based on Finite Element Method

  • Author

    Xu Huadong ; Wang Lihai

  • Author_Institution
    Coll. of Eng. & Technol., Northeast Forestry Univ., Harbin, China
  • Volume
    1
  • fYear
    2010
  • fDate
    13-14 March 2010
  • Firstpage
    874
  • Lastpage
    877
  • Abstract
    Wood is a kind of natural resource, and it has better strength and stiffness, so it is adapt to build wood structures, such as wooden bridge and building. However, wood is vulnerable to decay by all kinds of rot fungi, so it is need to find some effective methods to test the information of defect and evaluate the position and degree of defect. Finite element method (FEM) and experiment modal analysis (EMA) are used to obtain curvature modes of red pine standard specimen and hole-defect specimen with different sizes. Further analysis results of two methods show that curvature mode of defect part in wood always jumped abruptly to some extent, which is positive related to the size of the hole. Therefore modal analysis technology is proved to be accessible and feasible both in theory and in practice.
  • Keywords
    beams (structures); failure analysis; finite element analysis; modal analysis; nondestructive testing; structural engineering; wood; EMA; FEM; beams; curvature modal analysis; decay; defects; experiment modal analysis; finite element method; red pine; rot fungi; stiffness; wood structures; wooden bridge; wooden building; Automation; Bridges; Buildings; Educational institutions; Finite element methods; Forestry; Mechatronics; Modal analysis; Nondestructive testing; Shape; Curvature mode; EMA; FEM; Wood beams; non-destructive testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2010 International Conference on
  • Conference_Location
    Changsha City
  • Print_ISBN
    978-1-4244-5001-5
  • Electronic_ISBN
    978-1-4244-5739-7
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2010.475
  • Filename
    5458760