A 24-channel 300 Gb/s 8.2 pJ/bit full-duplex fiber-coupled optical transceiver module based on a single “holey” CMOS IC

Author

Rylyakov, Alexander V. ; Schow, Clint L. ; Doany, Fuad E. ; Lee, Benjamin G. ; Jahnes, Christopher ; Kwark, Young ; Baks, Christian ; Kuchta, Daniel M. ; Kash, Jeffrey A.

Author_Institution

T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA

fYear

2010

fDate

21-25 March 2010

Firstpage

1

Lastpage

3

Abstract

24-channel 850-nm VCSEL and PD arrays are flip-chip soldered to 90-nm CMOS "holey" 48-channel 12.5-Gb/s/channel transceiver chip, featuring through-substrate holes for optical I/O. Aggregate 300-Gb/s bi-drectional data rate is highest reported for single-chip transceiver modules.

Keywords

CMOS integrated circuits; optical fibre communication; transceivers; PD array; VCSEL array; bidrectional data rate; bit rate 300 Gbit/s; flip-chip; full-duplex fiber-coupled optical transceiver module; optical I/O; single holey CMOS IC; single-chip transceiver modules; size 850 nm; through-substrate holes; transceiver chip; CMOS integrated circuits; Connectors; High speed optical techniques; Optical arrays; Optical fiber testing; Optical fibers; Optical receivers; Photonic integrated circuits; Stimulated emission; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Fiber Communication (OFC), collocated National Fiber Optic Engineers Conference, 2010 Conference on (OFC/NFOEC)

Conference_Location

San Diego, CA

Electronic_ISBN

978-1-55752-884-1

Type

conf

Filename

5465784