DocumentCode
516945
Title
Tranisient Thermal Simulation and its Use in Power IC Design
Author
Antognetti, P. ; Bisio, G.R. ; Curatelli, F. ; Palara, S.
Author_Institution
University of Genova, Genova, Italy
fYear
1979
fDate
18-21 Sept. 1979
Firstpage
67
Lastpage
69
Keywords
Boundary conditions; Computer interfaces; Fourier series; Integrated circuit modeling; Physics computing; Power dissipation; Power integrated circuits; Protection; Temperature; Thermal factors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Circuits Conference - ESSCIRC 79, Fifth European
Conference_Location
Southampton, UK
Print_ISBN
0-85296-208-8
Type
conf
Filename
5468959
Link To Document