DocumentCode
518270
Title
Notice of Retraction
Interface analysis of refrigerated ice and aluminum plate
Author
Qingying Li ; Chunling Zhu
Author_Institution
Coll. of Aerosp. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
Volume
5
fYear
2010
fDate
16-18 April 2010
Abstract
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
Based on contact finite element analysis, a contact model is developed to study the interface properties of refrigerated ice and aluminum plate in this paper. The electro-impulse deicing (EIDI) excitation, that is, impulse force acting on the interfaces is simulated numerically. The values of adhesive tensile stress, interfacial shear stress and contact status of the contact surface are obtained. Calculations show that when the impulse force is below a certain value, the adhesive tensile stress increases with the impulse force and the interfacial shear stress is significant in magnitude to crack ice. When the impulse force exceeds the certain value, the adhesive tensile stress and the interfacial shear stress decrease to zero. Meanwhile, contact failure and interface fracture result. Thus, the impulse force takes over to remove ice from the adherence layer. Furthermore, the contact status varies from sticking contact to open far-field contact as the impulse force increases. In summary, by considering contact mechanics, the impulse force affects two aspects on the interfaces between the refrigerated ice and the aluminum plate, which involve the enhancement of adhesive action of the interfaces and the removal of the ice.
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
Based on contact finite element analysis, a contact model is developed to study the interface properties of refrigerated ice and aluminum plate in this paper. The electro-impulse deicing (EIDI) excitation, that is, impulse force acting on the interfaces is simulated numerically. The values of adhesive tensile stress, interfacial shear stress and contact status of the contact surface are obtained. Calculations show that when the impulse force is below a certain value, the adhesive tensile stress increases with the impulse force and the interfacial shear stress is significant in magnitude to crack ice. When the impulse force exceeds the certain value, the adhesive tensile stress and the interfacial shear stress decrease to zero. Meanwhile, contact failure and interface fracture result. Thus, the impulse force takes over to remove ice from the adherence layer. Furthermore, the contact status varies from sticking contact to open far-field contact as the impulse force increases. In summary, by considering contact mechanics, the impulse force affects two aspects on the interfaces between the refrigerated ice and the aluminum plate, which involve the enhancement of adhesive action of the interfaces and the removal of the ice.
Keywords
adhesives; finite element analysis; ice; mechanical contact; adhesive tensile stress; aluminum plate; contact finite element analysis; electro-impulse deicing excitation; impulse force; interface analysis; refrigerated ice; Aerospace engineering; Aircraft; Aluminum; Analytical models; Educational institutions; Electronic mail; Finite element methods; Ice; Refrigeration; Tensile stress; adhesive tensile stress; contact finite element analysis; contact status; impulse force; interfacial shear stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-6347-3
Type
conf
DOI
10.1109/ICCET.2010.5485949
Filename
5485949
Link To Document