DocumentCode
524129
Title
Low power design under parameter variations
Author
Bhunia, Swarup ; Roy, Kaushik
Author_Institution
Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
fYear
2008
fDate
11-13 Aug. 2008
Firstpage
137
Lastpage
138
Abstract
Design considerations for low-power operations and robustness with respect to variations typically impose contradictory design requirements. Low-power design techniques such as voltage scaling, dual-Vth and gate sizing can have large negative impact on parametric yield under process variations. In this tutorial, we focus on circuit/architectural design techniques for low power under parameter variations. We consider both logic and memory design and encompass modeling, analysis as well as design methodology to simultaneously achieve low power and variation tolerance. Design techniques to minimize power under parametric yield constraint as well as major process adaptation techniques using voltage scaling, adaptive body biasing or logic restructuring will be presented. Techniques to deal with within-die parameter variations in logic and memory circuits primarily caused by random dopant fluctuations will be discussed with emphasis on frequency assignments and body biasing. Finally, we will discuss temperature-aware design, dynamic adaptation to temperature and cover on-going research activities in related area such as low-power and variation tolerant multi-core processor design.
Keywords
integrated memory circuits; logic design; low-power electronics; microprocessor chips; adaptive body biasing; architectural design technique; circuit design technique; die parameter variation; dual-Vth sizing; frequency assignment; gate sizing; logic restructuring; low power design; memory circuit; memory design; parameter variations; process adaptation technique; random dopant fluctuations; temperature-aware design; variation tolerant multicore processor design; voltage scaling; Design methodology; Dynamic voltage scaling; Fluctuations; Frequency; Logic circuits; Logic design; Multicore processing; Process design; Robustness; Temperature; low power design; process variations;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED), 2008 ACM/IEEE International Symposium on
Conference_Location
Bangalore
Print_ISBN
978-1-4244-8634-2
Electronic_ISBN
978-1-60558-109-5
Type
conf
DOI
10.1145/1393921.1393957
Filename
5529071
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