Package level integration of a monolithic buck converter power IC and bondwire magnetics

Author

Jia, Hongwei ; Lu, Jian ; Wang, Xuexin ; Padmanabhan, Karthik ; Shea, Patrick ; Shen, Z. John

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA

fYear

2010

fDate

6-10 June 2010

Firstpage

51

Lastpage

54

Abstract

In this paper, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC was designed and fabricated with a standard 0.5μm CMOS process. Multi-turn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A 2.5V/120mA prototype system in package (SiP) buck converter is built to operate at frequencies up to 5MHz. The power level of the prototype buck converter is scalable by increasing the size of the active power switches.

Keywords

CMOS integrated circuits; power convertors; power integrated circuits; switches; system-in-package; CMOS process; active power switches; bondwire magnetics; current 120 mA; ferrite epoxy glob cores; filter inductor; in-package bondwire inductors; monolithic buck converter power integrated circuit; multiturn bondwires; package level integration; size 0.5 mum; system in package; voltage 2.5 V; Active filters; Bonding; Buck converters; CMOS process; Ferrites; Inductors; Integrated circuit packaging; Magnetic cores; Power integrated circuits; Prototypes;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on

Conference_Location

Hiroshima

ISSN

1943-653X

Print_ISBN

978-1-4244-7718-0

Electronic_ISBN

1943-653X

Type

conf

Filename

5543987