DocumentCode
534315
Title
Electro-thermal coupling analysis methodology for RF circuits
Author
Gómez, Dídac ; Mateo, Diego ; Altet, Josep
Author_Institution
Electron. Eng. Dept., Univ. Politec. de Catalunya, Barcelona, Spain
fYear
2010
fDate
6-8 Oct. 2010
Firstpage
1
Lastpage
6
Abstract
In this paper we present an electro-thermal coupling simulation technique for RF circuits. The proposed methodology takes advantage of well established tools for frequency translating circuits in order to significantly reduce the computational resources needed when frequencies of interest are separated by orders of magnitude.
Keywords
radiofrequency integrated circuits; RF circuits; computational resources; electrothermal coupling; orders of magnitude; translating circuits; Analytical models; Computational modeling; Couplings; Integrated circuit modeling; Radio frequency; Temperature sensors; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on
Conference_Location
Barcelona
Print_ISBN
978-1-4244-8453-9
Type
conf
Filename
5636315
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