DocumentCode
537073
Title
Preparation and Electrochemical Performance Comparison of Palladium-Nickel Bimetal Modified Electrodes
Author
Li, Baohua ; Ma, Yan ; Huang, Lei ; Yin, Zhaoming
Author_Institution
Xinjiang Ploytechnical Coll., Urumqi, China
fYear
2010
fDate
7-9 Nov. 2010
Firstpage
1
Lastpage
4
Abstract
The electrochemical deposition behaviors of Pd-Ni bimetal on different matrix materials were studied by means of the preparation of Pd-Ni/GC, Pd-Ni/foam-Ni and Pd-Ni/Ti electrodes. The effect of the matrix materials to the electrocatalytic activity of electrodes was investigated. CV results reveal that hydrogen absorbability of Pd-Ni/Ti electrode was obviously higher than the Pd-Ni/GC and Pd-Ni/foam-Ni electrodes and can get hydrogen adsorption peak of -121.08mA at -500mV (vs Hg/Hg2SO4). Scanning Electron Microscope (SEM) images reveal that Ti net is a better matrix material for disperse and deposition of bimetallic catalyst. Atomic Emission Spectrometry (AES) analyzed results indicate that The proper percent contents of Pd and Ni on Ti net elevate the catalyst activity of Pd-Ni bimetal. The high electrocatalytic activity electrode was obtained under nearly the same Pd deposit quantity and the decrease of the total catalyst deposit quantity, which has the high potential of reductive dechlorination.
Keywords
adsorption; atomic emission spectroscopy; catalysts; electrochemical electrodes; electrodeposition; nickel; palladium; scanning electron microscopy; Pd-Ni; Ti; atomic emission spectrometry; bimetallic catalyst; electrocatalytic activity; electrochemical deposition; electrochemical performance; hydrogen absorbability; matrix material; palladium-nickel bimetal modified electrode; reductive dechlorination; scanning electron microscopy; Electrodes; Iron; Materials; Mercury (metals); Nickel; Palladium; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
E-Product E-Service and E-Entertainment (ICEEE), 2010 International Conference on
Conference_Location
Henan
Print_ISBN
978-1-4244-7159-1
Type
conf
DOI
10.1109/ICEEE.2010.5660952
Filename
5660952
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