Research of Control and Scheduling for Die-Bonding

Author

Liao, Guangjun

Author_Institution

Fac. of Forensic Sci. & Technol., Guangdong Police Coll., Guangzhou, China

Volume

2

fYear

2010

fDate

16-17 Dec. 2010

Firstpage

9

Lastpage

11

Abstract

Die-bonding is a necessary machine in semiconductor production line. In the thesis, the control and scheduling for the machine is focused on. Firstly, analyzing atypical task-scheduling algorithm in single-processor real-time system and introducing the work flow. Secondly, giving the software framework based on thread-pool for the control platform. Finally, discussing motion control module and triode-wafer detection module in detail.

Keywords

control engineering computing; microassembling; motion control; production engineering computing; production equipment; semiconductor industry; single machine scheduling; control platform; die bonding; motion control module; production machine; semiconductor production line; single processor real time system; software framework; task scheduling algorithm; thread pool; triode wafer detection module; Instruction sets; Job shop scheduling; Microassembly; Motion control; Operating systems; Real time systems; Linux Operation System; Motion Control; Multi-task Cooperation; Wafer Detection;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent Systems (GCIS), 2010 Second WRI Global Congress on

Conference_Location

Wuhan

Print_ISBN

978-1-4244-9247-3

Type

conf

DOI

10.1109/GCIS.2010.152

Filename

5708666