DocumentCode
540724
Title
Development of 150W S-band GaN solid state power amplifier for satellite use
Author
Nakade, K. ; Seino, K. ; Tsuchiko, A. ; Kanaya, J.
Author_Institution
Space Syst. & Electron. Eng. Dept., Mitsubishi Electr. TOKKI Syst. Corp., Kamakura, Japan
fYear
2010
fDate
7-10 Dec. 2010
Firstpage
127
Lastpage
130
Abstract
150W S-band gallium nitride solid state power amplifier (GaN SSPA) has been developed for satellite use. GaN devices have been already used for various fields in lower frequency bands (L-band and S-band) such as ground station amplifier and radar system. For space application, there is great interest in realizing high power solid state power amplifier using GaN devices to achieve higher output power compare with current GaAs devices. Also there is very much interest for the performance comparison between GaN SSPA and traveling wave tube amplifiers (TWTAs). Development result shows that, with an electrical power conditioner (EPC), the GaN SSPA achieves output power of 148.6W with power added efficiency (PAE) of 53.8% which are almost equivalent to TWTA. Moreover, footprint and mass of this SSPA are much less than those of a TWTA. Also we confirmed through qualification testing that the GaN SSPA meets the environment requirements for satellite use.
Keywords
III-V semiconductors; UHF power amplifiers; gallium compounds; microwave power amplifiers; radar tracking; satellite ground stations; travelling wave tubes; wide band gap semiconductors; GaN; GaN devices; S-band GaN solid state power amplifier; electrical power conditioner; frequency 2 GHz to 4 GHz; gallium nitride; ground station amplifier; high power solid state power amplifier; power 150 W; radar system; satellite application; space application; traveling wave tube amplifiers; DH-HEMTs; Gallium nitride; MODFETs; Power amplifiers; Power generation; GaN HEMT; High efficiency; High power amplifiers; Satellite communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings (APMC), 2010 Asia-Pacific
Conference_Location
Yokohama
Print_ISBN
978-1-4244-7590-2
Electronic_ISBN
978-1-902339-22-2
Type
conf
Filename
5728607
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