• DocumentCode
    547400
  • Title

    Analysis of landing impact performance for lunar lander based on flexible body

  • Author

    Xu Lei ; Nie Hong ; Wan Junlin ; Lin Qing ; Chen Jinbao

  • Author_Institution
    Key Lab. of Fundamental Sci. for Nat. Defense-Adv. Design Technol. of Flight Vehicle, Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
  • Volume
    1
  • fYear
    2011
  • fDate
    10-12 June 2011
  • Firstpage
    10
  • Lastpage
    13
  • Abstract
    It is necessary to investigate the lunar lander soft-landing by considering the flexible body and legs because the impact of deformation is significant. There is a new method for research on landing impact performance in this paper. Firstly a dynamical model of 1/4 lunar lander with four suspension legs is build and simplified. After getting oscillation equation of the model, founds two simulation models respectively by multi-rigid-body dynamics method and nonlinear finite element method. The simulation of soft-landing selects MSC.ADMAS and MSC.DYTRAN. Main analysis objects are buffer distance of primary strut in lunar lander and vertical acceleration of box´s centroid, then contrasts two simulation results based on the objects. Research results show that the influence of flexible body reduces the maximum of primary strut´s buffer distance, but amplifies the vertical acceleration of centroid with periodic oscillation.
  • Keywords
    aerospace components; aerospace engineering; deformation; finite element analysis; impact (mechanical); space vehicles; vehicle dynamics; deformation impact; flexible body; flexible legs; landing impact performance; lunar lander; multirigid-body dynamics method; nonlinear finite element method; oscillation equation; Aerodynamics; Analytical models; Equations; Leg; Mathematical model; Moon; Vehicle dynamics; buffer; flexible body; lunar lander; nonlinear analysis; soft landing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-8727-1
  • Type

    conf

  • DOI
    10.1109/CSAE.2011.5953160
  • Filename
    5953160