• DocumentCode
    557738
  • Title

    An automatic matching scheme between 2D digital sketches and 3D template-models for virtual garment design

  • Author

    Jiang, Juan-Fen ; Zhong, Yue-Qi ; Wang, Shan-Yuan

  • Author_Institution
    Coll. of Textiles, Donghua Univ., Shanghai, China
  • Volume
    3
  • fYear
    2011
  • fDate
    15-17 Oct. 2011
  • Firstpage
    1334
  • Lastpage
    1338
  • Abstract
    In order to infer the 3D configuration of an input 2D sketch, this paper introduces an automatic matching scheme to build correspondences between 2D points on digital sketches and 3D vertices on template garments. A skirt model (3D template) is employed to illustrate the whole process. Given the input 2D strokes, uniform quadratic B-splines are used for curve approximation, and a sketch-based interface is introduced. In our approach, point-to-vertex correspondences are proposed, which is constrained by two characters: proximity and continuity. 2D template panels (the orthogonal projection of 3D template models) are generated to connect the 2D sketch points. Based on this initial matching, all corresponding vertices on 3D template models can be found automatically.
  • Keywords
    CAD; clothing; curve fitting; image matching; production engineering computing; solid modelling; splines (mathematics); user interfaces; virtual reality; 2D digital sketches; 2D strokes; 3D configuration; 3D template models; 3D template-models; 3D vertices; automatic matching scheme; curve approximation; input 2D sketch; orthogonal projection; point-to-vertex correspondences; proximity and continuity; sketch-based interface; skirt model; template garments; uniform quadratic B-splines; virtual garment design; Clothing; Computational modeling; Educational institutions; Hidden Markov models; Solid modeling; Spline; Three dimensional displays; 2D digital sketches; 3D template-models; B-spline; matching; virtual garment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image and Signal Processing (CISP), 2011 4th International Congress on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-9304-3
  • Type

    conf

  • DOI
    10.1109/CISP.2011.6100411
  • Filename
    6100411