• DocumentCode
    559620
  • Title

    Integration of ferroelectric BaTiO3 on metallic Ni tapes for power generation

  • Author

    Collins, Greg ; Silva, Emanuel ; Liu, Ming ; Elam, David ; Ma, Chunrui ; Chabanov, Andrey ; Ayon, Arturo ; Chen, Chonglin ; He, Jie ; Jiang, Jiechao ; Meletis, Efstathios

  • Author_Institution
    Univ. of Texas at San Antonio, San Antonio, TX, USA
  • fYear
    2011
  • fDate
    11-13 May 2011
  • Firstpage
    72
  • Lastpage
    74
  • Abstract
    Ferroelectric BaTiO3 thin films were integrated directly on metallic Ni tapes by using pulsed laser for energy harvesting applications. Microstructure studies from x-ray diffraction and electron microscopy indicate that the as-grown BaTiO3 thin films have pure BaTiO3 crystal phase which consists of the crystalline assemblage of nanopillars with average cross sections from 100 nm to 200 nm directly on the Ni tapes. The BaTiO3 films have good interface structures and strong adhesion to the Ni metallic tapes. Dielectric measurements have shown the hysteresis loop at room temperature in the film with a large remnant polarization, indicating that the ferroelectric domains have been created in the as-deposited BTO films. The successful integration of ferroelectric thin films directly on metallic materials is considered to be very promising for the development of energy harvesting devices.
  • Keywords
    X-ray diffraction; adhesion; barium compounds; crystal microstructure; electric domains; electric power generation; energy harvesting; ferroelectric thin films; hysteresis; nickel; BaTiO3; Ni; X-ray diffraction; adhesion; crystal phase; crystalline assemblage; dielectric measurements; electron microscopy; energy harvesting; ferroelectric domains; ferroelectric thin films; hysteresis loop; metallic Ni tapes; microstructure; nanopillars; power generation; pulsed laser; remnant polarization; temperature 293 K to 298 K; Films; Lattices; Nickel; Substrates; Temperature measurement; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
  • Conference_Location
    Aix-en-Provence
  • Print_ISBN
    978-1-61284-905-8
  • Type

    conf

  • Filename
    6108032