• DocumentCode
    564187
  • Title

    Design of low power wake-up circuits applied to OBU system chip

  • Author

    Zou, Jingjing ; Zhu, Siheng ; Feng, Kun ; Guo, Chao ; Hu, Jun ; Lv, Xin

  • Author_Institution
    Sch. of Inf. & Electron., Beijing Inst. of Technol., Beijing, China
  • Volume
    1
  • fYear
    2012
  • fDate
    5-8 May 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    With supplied by the battery, the low power consumption of OBU system chip in ETCS is demanded. This paper designs a low power wake-up circuits applied to OBU system chip. The circuit system extracts envelope signal from an amplitude shift keying (ASK) modulated 5.8 GHz carrier and converts it to digital signal. Only the envelop signal that the frequency of it is 14 KHz can produce the wake-up pulse, which effectively prevents error wake-up caused by other frequency signals. By incorporating an input impedance matching network, the wake-up circuits achieve input sensitivity of -35 dBm and the S11 of the match network is -19 dB with 50 Ω input impedance. Measurement results show the dc current is 6 μA from 2.4 V to 5 V supply. The wake-up circuits is fabricated in TSMC 0.18 μm RF CMOS 1P6M process and the entire chip occupies an areas of 375×330 μm2.
  • Keywords
    CMOS integrated circuits; amplitude shift keying; field effect MMIC; impedance matching; low-power electronics; ETCS; OBU system chip; TSMC RF CMOS 1P6M process; amplitude shift keying; current 6 muA; digital signal; electronic toll collection system; envelope signal extraction; frequency 14 kHz; frequency 5.8 GHz; frequency signals; input impedance matching network; low power consumption; low power wake-up circuit design; on board unit; resistance 50 ohm; size 0.18 mum; voltage 2.4 V to 5 V; wake-up pulse; Detectors; Junctions; Power demand; Radio frequency; Resistance; Sensitivity; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4673-2184-6
  • Type

    conf

  • DOI
    10.1109/ICMMT.2012.6229898
  • Filename
    6229898