• DocumentCode
    564753
  • Title

    New dual-curvature microlens array with high fill-factor for organic light emitting diode modules

  • Author

    Lin, Tsung-Hung ; Yang, Hsiharng ; Chao, Ching-Kong ; Shui, Hung-Chi

  • Author_Institution
    Grad. Inst. of Appl. Sci. & Technol., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
  • fYear
    2012
  • fDate
    25-27 April 2012
  • Firstpage
    224
  • Lastpage
    229
  • Abstract
    A new method to fabricate a novel dual-curvature microlens array with high fill-factor using the proximity printing in lithography process is reported. The lens profiles including dual-curvatures which are a new shape composed of triangle and hexagon. We utilized the UV proximity printing by controlling a printing gap between the mask and substrate. The designed a high density microlens array pattern can be fabricated dual-curvature microlens array with high fill-factor in photoresist. It is due to the UV light diffraction to deflect away from the aperture edges and produces a certain exposure in photoresist material outside the aperture edges. A dual-curvature microlens array with 0.48 of height ratio can boost axial luminance up to 22%. Therefore, dual-curvature microlens array will be an economical solution for increasing the luminance of organic light emitting diodes.
  • Keywords
    brightness; light diffraction; microlenses; organic light emitting diodes; photoresists; ultraviolet lithography; UV light diffraction; UV proximity printing; aperture edges; boost axial luminance; dual-curvature microlens array; dual-curvature microlens array fabrication; economical solution; height ratio; hexagon shape composition; high density microlens array pattern; high fill-factor; lens profiles; lithography process; organic light emitting diode modules; organic light emitting diodes luminance; photoresist material outside; printing gap control; triangle shape composition; Arrays; Fabrication; Lenses; Microoptics; Organic light emitting diodes; Printing; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
  • Conference_Location
    Cannes
  • Print_ISBN
    978-1-4673-0785-7
  • Type

    conf

  • Filename
    6235293