DocumentCode
564753
Title
New dual-curvature microlens array with high fill-factor for organic light emitting diode modules
Author
Lin, Tsung-Hung ; Yang, Hsiharng ; Chao, Ching-Kong ; Shui, Hung-Chi
Author_Institution
Grad. Inst. of Appl. Sci. & Technol., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
fYear
2012
fDate
25-27 April 2012
Firstpage
224
Lastpage
229
Abstract
A new method to fabricate a novel dual-curvature microlens array with high fill-factor using the proximity printing in lithography process is reported. The lens profiles including dual-curvatures which are a new shape composed of triangle and hexagon. We utilized the UV proximity printing by controlling a printing gap between the mask and substrate. The designed a high density microlens array pattern can be fabricated dual-curvature microlens array with high fill-factor in photoresist. It is due to the UV light diffraction to deflect away from the aperture edges and produces a certain exposure in photoresist material outside the aperture edges. A dual-curvature microlens array with 0.48 of height ratio can boost axial luminance up to 22%. Therefore, dual-curvature microlens array will be an economical solution for increasing the luminance of organic light emitting diodes.
Keywords
brightness; light diffraction; microlenses; organic light emitting diodes; photoresists; ultraviolet lithography; UV light diffraction; UV proximity printing; aperture edges; boost axial luminance; dual-curvature microlens array; dual-curvature microlens array fabrication; economical solution; height ratio; hexagon shape composition; high density microlens array pattern; high fill-factor; lens profiles; lithography process; organic light emitting diode modules; organic light emitting diodes luminance; photoresist material outside; printing gap control; triangle shape composition; Arrays; Fabrication; Lenses; Microoptics; Organic light emitting diodes; Printing; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location
Cannes
Print_ISBN
978-1-4673-0785-7
Type
conf
Filename
6235293
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