DocumentCode
564766
Title
LTCC package manufacturing using powder blasting technology
Author
Lacrotte, Yves ; Carr, John P. ; Kay, Robert W. ; Desmulliez, Marc P Y
Author_Institution
Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
fYear
2012
fDate
25-27 April 2012
Firstpage
186
Lastpage
191
Abstract
This paper presents the application of the powder blasting technique for the fabrication of the LTCC package that is to host an optical sensor device. The package consists of several layers of green tape ceramic featuring aperture sizes ranging from 3mm to 0.1mm in diameter. These layers have been patterned using fine alumina particles of 9μm in diameter in combination with an electroplated nickel mask coated with a protective layer. The latter is based on a photosensitive material laid down on top of the metallic surface, exposed and developed to free the metal apertures from the coating. The results show that the wide range of apertures size present in the mask can be used to machine the green ceramic. The quality of the structures is smooth and vias shapes are perfectly circular. These results were obtained at 50 psi with a flow rate of 0.20g/s for a distance of 20 mm between the tip of the nozzle and the substrate.
Keywords
alumina; ceramic packaging; electroplating; masks; optical sensors; semiconductor industry; Al2O3; LTCC package manufacturing; apertures size; distance 20 mm; electroplated nickel mask; fine alumina particles; green tape ceramic; low temperature cofired ceramic; metal apertures; metallic surface; optical sensor device; photosensitive material; powder blasting technology; protective layer; size 3 mm to 0.1 mm; size 9 mum; Apertures; Ceramics; Films; Powders; Resists; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location
Cannes
Print_ISBN
978-1-4673-0785-7
Type
conf
Filename
6235306
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