Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield

3D technologies need a high speed high alignment accuracy chip-to-wafer hybridation technique. This paper will focus on chip-to-wafer self assembly processes coupled with direct bonding hybridation. Submicronic alignment accuracy and a 90 per cent self-assembly process yield are obtained. The self-assembly process yield is analyzed in term of alignment accuracy and direct bonding quality. The impact of the chip´s surface state (hydrophilic, hydrophobic, and mixed) on fluid containment efficiency and self-assembly process yield will be discussed. Topological containment (canthotaxis effect) is also evaluated with regards to structures height. Finally, the alignment yield as a function of deposition parameters will be described.